The Crack Opening Method in Silicon Wafer Bonding How Useful Is It

摘要: The crack opening method is widely used for the determination of surface energy two bonded wafers, which associated with required to separate wafers. In present paper dependence measured silicon wafers on time after insertion a blade at various pressures, silanol group densities, and annealing temperatures reported. At normal conditions (air pressure, room temperature, 30% humidity) strong effective found were annealed 200, 400, 900°C. For without subsequent this phenomenon not observed. Additional measurements under reduced pressure show that debonding process appears be related adsorption chemical reaction water molecules sites broken bonds opened surfaces. We conclude meaningful comparison energies requires detailed information measurement conditions.