Shear-horizontal surface acoustic wave phononic device with high density filling material for ultra-low power sensing applications
作者： M. Richardson , S. K. R. S. Sankaranarayanan , V. R. Bhethanabotla
DOI: 10.1063/1.4884655
关键词: Finite element method 、 Tungsten 、 Materials science 、 Band gap 、 Surface acoustic wave 、 Optoelectronics 、 Insertion loss 、 Interference (wave propagation) 、 Phonon 、 Tantalum
摘要: Finite element simulations of a phononic shear-horizontal surface acoustic wave (SAW) sensor based on ST 90°-X Quartz reveal dramatic reduction in power consumption. The is realized by artificially structuring the delay path to form an meta-material comprised periodic microcavity array incorporating high-density materials such as tantalum or tungsten. Constructive interference scattered and secondary reflected waves at every interface leads energy confinement regions translating into reduced loss. Tantalum filled cavities show best performance while tungsten inclusions create bandgap. Based our simulation results, SAW devices with microcavities were fabricated shown significantly decrease insertion Our findings offer encouraging prospects for designing low power, highly sensitive portable biosensors.
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