Method and structure for dissipating heat away from a resistor having neighboring devices and interconnects
作者： Bor-Jou Wei , Chin Chuan Peng , Chien Shih Tsai , Jian-Hong Lin , Tzu-Li Lee
DOI:
关键词: Thermal protection 、 Semiconductor structure 、 Electrical engineering 、 Optoelectronics 、 Electrical conductor 、 Resistor 、 Materials science 、 Thermal
摘要: A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects. The includes substrate, disposed above the thermal protection resistor. has plurality of elements, elements one end in conductive contact with other substrate. receives generated dissipates to
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