Multi-die package with separate inter-die interconnects
作者： Josef Hoglauer , Khalil Hosseini , Joachim Mahler
DOI:
关键词: Die (integrated circuit) 、 Optoelectronics 、 Materials science 、 Electrode 、 Substrate (printing) 、 Electrical engineering 、 Layer (electronics) 、 Electrical conductor
摘要: A first electrode at a side of semiconductor die is connected to conductive region substrate. second the Each has an opposing respective die. metal layer extends from periphery substrate over The generally rectangular cross-sectional area and connects one regions in separate dies. electrodes
lens.org 参考文章(14)
Martin Standing, Semiconductor package including two semiconductor die disposed within a common clip ,(2002)
Ruben P. Madrid, Semiconductor die package with clip interconnection ,(2008)
François Hébert, Allen Chang, Multi-die DC-DC Buck Power Converter with Efficient Packaging ,(2007)
Christopher P. Schaffer, High power MCM package ,(2003)
Liang Zhao, Jun Lu, Yueh-Se Ho, Lei Shi, Yan Xun Xue, Stacked power semiconductor device using dual lead frame and manufacturing method ,(2011)
Eung San Cho, Multi-transistor exposed conductive clip for high power semiconductor packages ,(2011)
Mark Steers, Peter R. Ewer, High current capacity semiconductor device housing ,(1999)
Venkat Iyer, Ti Ching Shian, Erwin Victor R. Cruz, Elsie Cabahug, Semiconductor die package using leadframe and clip and method of manufacturing ,(2005)
Michael J. Seddon, Francis J. Carney, Semiconductor package structure having enhanced thermal dissipation characteristics ,(2004)
Ralf Otremba, Semiconductor Module With Semiconductor Chips And Method For Producing It ,(2007)