Semiconductor package including two semiconductor die disposed within a common clip

作者: Martin Standing

DOI:

关键词:

摘要: A co-package semiconductor device including an outer clip in the form of a metal can includes also two dies, at least one which uses as electrical connector. An inner is used to dispose dies within clip. The may be insulated from by insulating layer.

参考文章(12)
Kenji Otobe, Tatsuya Hashinaga, Ken-ichiro Matsuzaki, Gaku Ishii, Power amplifying module ,(1996)
Christopher Davis, Daniel M. Kinzer, Chuan Cheah, Commonly housed diverse semiconductor die ,(2001)
Kunio Nishihara, Takayuki Ishikawa, Youichi Hosono, Takashi Kayama, Kunihiro Nagamine, Solid printed substrate and electronic circuit package using the same ,(1993)
Martin Standing, Hazel Deborah Schofield, Chip scale surface mounted device and process of manufacture ,(2001)
J Smith, G Drennan, Microcircuit package assembly ,(1971)
Akira Horie, Yoshihiko Koike, Syuuji Saitoo, Shin Kimura, Kiyoshi Nakata, Mutsuhiro Mori, Ryuichi Saito, Shigeki Sekine, Semiconductor module including switching device chips and diode chips ,(1997)
Masafumi Ozawa, Hiroshi Yoshida, Tsuyoshi Tojo, Semiconductor device package, and fabrication method thereof ,(1999)