Microcircuit package assembly

作者: J Smith , G Drennan

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摘要: A hermetically sealed package for microcircuits employs a base plate on which one or more may be mounted by, example, soldering thereto by means of studs, the studs being positioned in so as to accommodate are held down plate, spring fasteners studs. The heat conductive carrier base. Electrical feedthroughs plate. In certain forms package, an isolation wall structure is employed isolate microcircuit from another, secured via and stud fasteners. cover over microcircuits, carrier, feedthroughs. novel diffusion weld technique used seal

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