Semiconductor device package, and fabrication method thereof
作者： Masafumi Ozawa , Hiroshi Yoshida , Tsuyoshi Tojo
DOI:
关键词:
摘要: A conductive mounting board provided in a package has recessed portion and projecting portion, an insulating is disposed on the portion. The surface of which wiring disposed. semiconductor laser, constituted by stacked layers each being made from compound composed group III based nitride, board. An n-side electrode laser contact with p-side thereof Heat generated radiated via board, short-circuit between prevented In alternative device, element fixed to projects
google.de 参考文章(23)
John J. Consoli, Connector for a flexible circuit ,(1992)
Yasuo Kasai, Koichi Yamada, Teruo Sakuma, Masahiro Koguchi, Making process of a die for stamping out patterns ,(1983)
Housan Dakroub, Alvin E. Cox, Electrical compression connector for a disc drive ,(1999)
Paolo Casati, Giuseppe Libretti, Modular power circuit assembly ,(1993)
Jeffery Ralph Daanen, Mark Anthony Koors, Scott David Brandenburg, Method of forming an overmolded electronic assembly ,(1998)
Philip M. Fabis, Electronic circuit package with diamond film heat conductor ,(1999)
George Anthony Brathwaite, Doanh D. Bui, Paul R. Hoffman, Deepak Mahulikar, Electronic package having improved wire bonding capability ,(1995)
Douglas Wallace Phelps, William Carroll Ward, Edward John Dombroski, Tape application platform and processes therefor ,(1995)
Brian G. Spreadbury, Charlie W. Gilson, Horst F. Irmscher, Tim J. Jondrow, Paul A. Rubens, Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink ,(1997)
George R. Hagner, Circuit boards with recessed traces ,(1989)