Method of forming package systems having interposers
作者： Chen-Hua Yu , Yung-Chi Lin , Jing-Cheng Lin
DOI:
关键词: Layer (electronics) 、 Optoelectronics 、 Electrical connection 、 Engineering 、 Integrated circuit 、 Electronic engineering 、 Molding (process) 、 Interconnection 、 Interposer
摘要: A package system includes a first integrated circuit disposed over an interposer. The interposer at least one molding compound layer including plurality of electrical connection structures through the layer. interconnect structure is surface and electrically coupled with structures. structure.
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