Semiconductor Device and Method of Forming Dual-Active Sided Semiconductor Die in Fan-Out Wafer Level Chip Scale Package
作者： Reza A. Pagaila
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摘要: In a semiconductor device, plurality of conductive pillars is formed over temporary carrier. A dual-active sided die mounted the carrier between pillars. The has first and second opposing active surfaces with contact pads on surface surface. An encapsulant deposited interconnect structure encapsulant. electrically connected to die. removed. opposite
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