Semiconductor device having heat dissipation structure and laminate of semiconductor devices
作者： Takao Ochi , 越智 岳雄
DOI:
关键词: Materials science 、 Conductor 、 Optoelectronics 、 Thermal management of electronic devices and systems 、 Electrode 、 Semiconductor device 、 Electronic engineering
摘要: This semiconductor device is provided with: a substrate; an electrode that arranged on first surface of the circuit formed second substrate, said being reverse side surface; conductor connects and with each other; lead outer periphery connection member sealing material seals member. The substrate exposed from material.
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