Semiconductor Device and Method of Forming Wafer-Level Multi-Row Etched Leadframe With Base Leads and Embedded Semiconductor Die
作者： Dioscoro A. Merilo , Henry D. Bathan , Zigmund R. Camacho , Emmanuel A. Espiritu
DOI:
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摘要: A semiconductor device has a base substrate with first and second opposing surfaces. plurality of cavities leads between the is formed in surface substrate. The set can have different height or similar as leads. concave capture pad be over Alternatively, openings die mounted to openings. An encapsulant deposited portion removed separate interconnect structure
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