Laminate for printed circuit boards

作者: Michael Aggleton , Neil Brown

DOI:

关键词: Materials scienceAluminiumRepresentation (systemics)Thermal stabilityPrinted circuit boardEngineering drawing

摘要: The present invention relates to printed circuit board laminates which are characterized by improved thermal stability. properties attributed the use of a novel aluminium hydroxyde is described molecular representation: Al2O3.nH2O where n > 2.6 and < 2.9.

参考文章(6)
Neil Brown, Michael Aggleton, Nonhygroscopic thermally stable aluminum hydroxide ,(1999)
Chanakya Misra, Industrial alumina chemicals ,(1986)
Reinhold Rohlmann, Dieter J. Dr. Dipl.-Chem. Braun, Aluminium hydroxide fillers and process for preparing them ,(1984)
Hiroshi Konagaya, Kinichi Hasegawa, Yoshitake Tanaka, Laminated board for printed circuit ,(1983)
Keiji Imasho, Kiyoyuki Minamimura, Laminated board for printed circuit ,(1991)