作者: Thomas S. Kohm
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摘要: A base material for printed wiring boards is formed by laminating together layers of prepregs woven cloth impregnated with a thermosetting polymeric resin varnish. The varnish has an inorganic filler which present in amount sufficient to provide the average coefficient thermal expansion along its Z-axis between 30°C and 270°C equal or less than copper from plus maximum elongation at suitable forming conductive pattern on hole walls boards. Printed manufactured additive subtractive processes are resistent failure stress cycling.