Method of depositing a stress-free electroless copper deposit
作者： Kim L. Morton , William M. Beckenbaugh
DOI:
关键词: Inorganic chemistry 、 Ethylenediaminetetraacetic acid 、 Copper 、 Chemistry 、 Catalysis 、 Acetic acid 、 Reducing agent 、 Ethylenediamine 、 Chelation 、 Cyanide
摘要: A method of depositing a stress-free electroless copper deposit is disclosed. The comprises contacting catalyzed surface with solution comprising source cupric ions; reducing agent for the complexing selected from (a) ethylenediaminetetraacetic acid, (b) salt (a), (c) modified ethylenediamine acetic (d) (c), and (e) mixture at least two foregoing agents; stabilizer mercury compound; an accelerator water-soluble compound containing cyanide radical (CN-) complexed metal Group VIII Periodic Table Elements.
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