Process for the photoselective metallization on non-conductive plastic base materials
作者： David C. Frisch , Wilhelm Weber
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摘要: Catalytically imaged thermosetting and thermoplastic resin objects including printed circuit boards are provided. A hydrophilic, adhesion promoted insulating base material is treated in selected areas to produce metallic nuclei the form of an image a desired metal pattern. The exposed electroless bath reinforce image. Then, non-imaged rendered hydrophobic by means solvent treatment. built up deposition. Preferably, treatment repeated enhance pattern material.
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