Electroless copper plating solution and process for formation of copper film

摘要: Disclosed are an electroless copper plating solution comprising a ion, ion-complexing agent, reducing agent and pH-adjusting the trialkanolmonoamine or salt thereof as complexing accelerator in amount giving higher deposition speed than obtained when is present sufficient to complex ion but not enough function accelerator, 1.2×10-4 1.2×10-3 mole/l of iron compound reaction initiator and/or 1.92×10-4 1.92×10-3 at least one selected from group consisting pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, α,α,α-terpyridine, phthalic acid, isophthalic acid 2,2'-dibenzoic for improving physical properties film, process forming film by using this solution.