Sulfate-free electroless copper plating baths
作者： Nicholas Michael Martyak , Henry Hung-Yeh Chien , Bruce Francis Monzyk
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摘要: Sulfate-free electroless copper baths comprising cupric ions, formaldehyde, formate hydroxyl a counterion, e g. preferably monovalent anion such as acetate, nitrate or formate, and chelant an alkali metal salt of aminotris(methylenephosphonic acid), biscarboxymethylaspartic acid, ethylenediaminetetra(methylenephosphonic diethylenetriaminepenta(methylenephosphonic gluconic 1-hydroxyethylidene-1,1-diphosphonic mucic D-saccharac tartaric acid N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine are amenable to the recovery copper, e.g. from purge streams, using methods apparatus including solvent extraction, employing hydroxamic extractants, filtration, ion-exchange precipitation.
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