Bonding compositions for the manufacture of additive printed wiring boards and printed wiring boards made with the bonding composition

摘要: This invention concerns a bonding composition useful for the manufacture of fully and semi-additive printed wiring boards. The comprises phenolic resin substantially free methyl ether groups with an average four to ten rings per molecule at least two methylol functional groups; one heat resistant polymer aromatic or cyclic backbone capble crosslinking without evolving water present in amount sufficient react 30 60% by weight elastomer. is applied cured on base material. After curing, com­position capable being adhesion promoted ad­herent electroless metal deposition. maintaining bond de­posited 10 seconds during repair cycles soldering iron 430°C.