Cooling mechanism of substrate in vacuum treatment device

摘要: PURPOSE:To control the pressure of an introduced cooling gas exactly by provid ing introducing port to be fed a space and outlet from cooled, substrate holder, controlling space. CONSTITUTION:The passes through 6 on holder via flow rate device 9 valve 8, flows into 5 at rear side 3, which is discharged each 7 10 conduct ance 11. In this case, controlled fixed function conductance 11 discharging side. Accordingly, temp. 3 range for thermal input. The in prevented being leaked toward front namely high vacuum side, sealing material 2.