Semiconductor structure, pad structure and protection structure
作者： Chao-An Su , Meng-Jia Lin , Tzung-I Su , Tzung-Han Tan , Ming-I Wang
DOI:
关键词: Electrical engineering 、 Spark plug 、 Substrate (printing) 、 Dielectric layer 、 Semiconductor structure 、 Materials science 、 Optoelectronics
摘要: A semiconductor structure is provided. The includes a substrate, dielectric layer, pad and protection structure. layer disposed on the substrate. in layer. plurality of first metal layers plugs which are electrically connected to each other vertically. There no contact plug between encompasses
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