Bond-pad with pad edge strengthening structure
作者： Shi-Tron Lin , Chin-Jong Chan
DOI:
关键词: Wafer 、 Bond 、 Semiconductor device 、 Wire bonding 、 Materials science 、 Middle layer 、 Discontinuity (geotechnical engineering) 、 Structural engineering 、 Metallic bonding 、 Semiconductor 、 Composite material
摘要: A bond pad structure for use in wire bonding application during the packaging operation of semiconductor devices which contains a frame holding place to prevent peel-off problem. The is laminated containing metal layer, middle dielectric and an underlying layer formed above wafer surface. guard band spaced apart relationship from connected by hole-fill. can be such as polysilicon or any material has good adhesion with hole fill material. exerts downward force against help keeping place. also creates localized discontinuity intercept cracks that may around edge believed main cause
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