作者: Julius Kozak , Michael A. Kast , Neil Bergstrom , Rajiv Pethe , Scott C-J. Tseng
DOI:
关键词: Fabrication 、 Stamping 、 Engineering drawing 、 Composite material 、 Electrical conductor 、 Shearing (physics) 、 Electrically conductive 、 Thermal 、 Materials science 、 Single step 、 Process (computing)
摘要: In a method of forming micro traces (64; 110, 112 and 114; 409), stamping techniques are employed to define target pattern the traces. The is applied electrically conductive material (405; 700) may be limited pressure, but thermal approach utilized. Following stamping, portion removed (305), leaving pressure-application step, pressure or combination temperature sufficient at least weaken integrity bulk along area contact. Typically, this step causes shearing material. excess removed. some embodiments invention, thickness not determined in single step. original formed using 'seed' (104). subsequent buildup (108) occur after established.