Method for hot-embossing of at least one circuit path on a substrate and a substrate with at least one circuit path
作者： Johanna May , Tjalf Pirk
DOI:
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摘要: The invention relates to a method for hot-embossing at least one circuit path (12) on plastic substrate (1) wherein metal is pressed in die direction by means of an embossing (6) having structured surface. Accordingly, the provides that present as metalizing coating (4, 5). Furthermore, (1).
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