Method of manufacturing a patterned array of solder bumps
作者： Robert P. Mccollam , Randolph D. Schueller , David C. Koskenmaki
DOI:
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摘要: The present invention relates to a method for making an array of metal balls. includes the step generating first pattern on foil which plurality projections. also second carrier substrate. pluraltiy recesses that are arranged and configured correspond with projections pattern. further steps placing substrate together such fit within substrate, melting form balls positioned ball arrays constructed via above method.
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