Method of manufacturing porous dielectric films having a very low permittivity
作者： Aziz Zenasni , Hélène Trouve , Patrick Leduc , Vincent Jousseaume
DOI:
关键词: Matrix (mathematics) 、 Substrate (electronics) 、 Deposition (phase transition) 、 Base (chemistry) 、 Porosity 、 Composite material 、 Dielectric 、 Materials science 、 Microelectronics 、 Permittivity
摘要: The present invention relates to a method of manufacturing porous dielectric film having very low permittivity, which comprises: a) the deposition composite on substrate, said comprising material forming matrix and heat-decomposable pore former dispersed in this matrix; b) treatment order crosslink c) heat thermally decompose thus extract it from matrix, steps are carried out succession or simultaneously, is characterized that furthermore includes, between c), step treating with an acid base. Field applications: microelectronics.
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