作者: A.M. Padovani , S.A. Bidstrup Allen , P.A. Kohl
DOI: 10.1109/ISAPM.2002.990360
关键词:
摘要: This work focused on the development, characterization, and optimization of properties silsesquioxane-based, low dielectric constant porous materials for use in high density interconnect applications. The goal was to modify a commercially available spin-on-glass (methylsilsesquioxane), introduce porosity into films lower effective silsesquioxane resin. pores were created by adding sacrificial polymer (substituted norbornene polymer) matrix, then thermally decomposing within form nano-size voids (/spl sim/5 nm). Studies pore size distribution, interconnectivity, chemical bonding spin-on-glass, mechanical, electrical optical have been performed. Transmission electron microscopy experiments conducted investigate distribution as function molecular weight, concentration type functional groups polymer, loading level. mechanical investigated using nanoindentation techniques, and, general, it shown that had superior fracture toughness (resistance cracking) compared those without pores.