A.M. Padovani , S.A. Bidstrup Allen , P.A. Kohl
international symposium on advanced packaging materials 20 -24
R.V. Tanikella , S.A. Bidstrup Allen , P.A. Kohl
international symposium on advanced packaging materials 254 -259
S. Park , J. Krotine , S.A. Bidstrup Allen , P.A. Kohl
international symposium on advanced packaging materials 117 -117
J.P. Jayachandran , H.A. Reed , H. Zhen , L.F. Rhodes
IEEE\/ASME Journal of Microelectromechanical Systems 12 ( 2) 147 -159
T. R. Remmers , S. N. Tucker , D. R. Johnston , S. Allen
AGO report
L. Connolly , G. Walker , S. Allen , E. J. Stewarts
21st International Congress of Chemical and Process Engineering, CHISA 2014 and 17th Conference on Process Integration, Modelling and Optimisation for Energy Saving and Pollution Reduction, PRES 2014
N. El-Zein , M. Deshpande , G. Kramer , J. Lewis
international conference on indium phosphide and related materials 146 -149
H. Hayden , E. Elce , S. Allen , P.A. Kohl
IEEE Transactions on Advanced Packaging 32 ( 4) 758 -767
M.J.W. Rodwell , S. Allen , M. Case , R. Yu
european microwave conference 8 -10
K. Shiralagi , R. Tsui , H. Goronkin , S. Pendharkar
Journal of Electronic Materials 27 ( 1)
Christopher W. Macosko , Sue Ann Bidstrup
Annual Technical Conference - Society of Plastics Engineers 278 -281
Christopher W. Macosko , Sue Ann Bidstrup
SAMPE 551 -562
Sue Ann Bidstrup , Paul A. Kohl , Frank Stepniak
Multichip Modules 2575 336
Yong Wang , Guang Yuan , Yong-Kyu Yoon , Mark G. Allen
International Journal of Heat and Mass Transfer 49 ( 13-14) 2173 -2179
Linda Lin , Sue Ann Bidstrup
Journal of Applied Polymer Science 49 ( 7) 1277 -1289
Joycelyn O. Simpson , Sue Ann Bidstrup
Journal of Polymer Science Part B: Polymer Physics 31 ( 5) 609 -618
Sue Ann Bidstrup , Joycelyn O. Simpson
Journal of Polymer Science Part B: Polymer Physics 33 ( 1) 43 -54
Joycelyn O. Simpson , Sue Ann Bidstrup
Journal of Polymer Science Part B: Polymer Physics 33 ( 1) 55 -62
Sue Ann Bidstrup , Christopher W. Macosko
Journal of Polymer Science Part B: Polymer Physics 28 ( 5) 691 -709
Yong Wang , Guang Yuan , Yong-Kyu Yoon , Mark G. Allen
Journal of Electronic Packaging 128 ( 4) 353 -359