Scribe street seals in semiconductor devices and method of fabrication
作者： Jeffrey A. West , Paul M. Gillespie
DOI:
关键词: Wafer 、 Fabrication 、 Composite material 、 Seal (mechanical) 、 Layer (electronics) 、 Materials science 、 Integrated circuit 、 Edge (geometry) 、 Wafer dicing 、 Electronic engineering 、 Line (electrical engineering)
摘要: An integrated circuit wafer, covered by a protective overcoat, comprising an array of chips bordered seal regions and separated dicing lines; at least two sets substantially parallel structures within each said regions, set extending along the edge chip on opposite sides line, respectively; one continuous barrier wall adjacent chip, sacrificial composite structure in combination therewith, between center being discontinuous metal rivets interconnecting electrically conductive layers alternating manner, whereby provides mechanical strength to simultaneously disperses energy associated with crack propagation; slot opened into reaching from surface overcoat surface-nearest layer structure, cracks propagating will be stopped.
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