MICROELECTRONICS ASSEMBLY INCLUDING TOP AND BOTTOM PACKAGES IN STACKED CONFIGURATION WITH SHARED COOLING
作者： Subbareddy Dheeraj , Hossain Md Altaf , Nalamalpu Ankireddy , Sankman Robert
DOI:
关键词: Printed circuit board 、 Integrated circuit 、 Insulator (electricity) 、 Electrically conductive 、 Microelectronics 、 Mechanical engineering 、 Materials science
摘要: An integrated circuit structure that includes a first package and second is described. The two packages can be stacked above, for example, printed board. top inverted, such die of facing the bottom package. A cooling arrangement in gap between packages, thermally coupled to die. transfer heat generated by In some cases, structures comprising electrically conductive material (e.g., metal) are encapsulated molding compound or insulator, extend substrate
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