Hybrid high-power microwave-frequency integrated circuit
作者： Eduard Volfovich Aizenberg , Vladimir Iliich Beil , Viktor Anatolievich Iovdalsky
DOI:
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摘要: A hybrid high-power microwave-frequency integrated circuit comprises a board (5) having recess (10) on its rear side under the projection (2) of base (1), wherein openings (11) predetermined size are formed at bottom said recess. The upper part (1) is free from crystal (3) and connected to (10). section comprising contact surfaces (4) grounded through distance between walls opening (8) where it mounted does not exceed 150 νm, while grounding νm.
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