Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
作者： Jing Li , Yuhong Liu , Tongqing Wang , Xinchun Lu , Jianbin Luo
DOI: 10.1016/J.APSUSC.2012.11.106
关键词: Chemical-mechanical planarization 、 Passivation 、 Electrochemistry 、 Kinetics 、 Chronoamperometry 、 Copper 、 Inorganic chemistry 、 Double layer (biology) 、 Current density 、 Chemistry
摘要: Abstract During the process of chemical mechanical planarization (CMP) copper interconnection in ultra large scale integration (ULSI), passivation plays a critical role material removal. The kinetics glycine solutions containing BTA was studied by chronoamperometry technique. results showed that current density transients followed with double-exponential decay, including both non-faradaic double layer charging and faradaic reaction effects. Furthermore, model based on proposed for low-pressure CMP. Combining experimental results, removal mechanism analyzed. effect dominated at pH 4, while it dominant 10.
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