Anion Effects on Cu–benzotriazole Film Formation Implications for CMP

作者: Karen L. Stewart , Jian Zhang , Shoutian Li , Phillip W. Carter , Andrew A. Gewirth

DOI: 10.1149/1.2393013

关键词: Mass spectrometryRaman spectroscopyAtomic force microscopyEllipsometryIonChemical-mechanical planarizationAnalytical chemistryBenzotriazoleInorganic chemistryChemistry

摘要: We examine the effect of different anions in solutions containing benzotriazole (BTA) on Cu removal rate during chemical mechanical planarization (CMP). In both Cl - and BTA, is nearly a factor twenty lower than either or BTA alone. As-grown films from are characterized using atomic force microscopy, ellipsometry, Raman spectroscopy, mass spectrometry, open-circuit-potential measurements. Films grown halide-containing found to be considerably thicker those other anions. The difference correlates well with as-grown film thicknesses.

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