Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect
作者： Stefan Beer , Heiko Gulan , Christian Rusch , Thomas Zwick
关键词: Electrical impedance 、 Flip chip 、 Monolithic microwave integrated circuit 、 Optoelectronics 、 Materials science 、 Integrated circuit packaging 、 Microstrip antenna 、 Electrical engineering 、 Chip-scale package 、 Dipole antenna 、 Surface-mount technology
摘要: A packaging solution for the integration of an MMIC and a thin film antenna into single surface-mountable package is presented. It based on air cavity in base which placed. All package-to-MMIC interconnects are routed through substrate all connections realized using flip chip technology. Thus wire bonds eliminated within whole package. broadband interconnect used to connect antenna. As situated above cavity, large bandwidth also achieved An antenna-in-package prototype presented demonstrate feasibility assembly process test performance including interconnect. The influence additional cover analyzed by measuring covered with two different lids.
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