D-band grid-array antenna integrated in the lid of a surface-mountable chip-package
作者： H. Gulan , C. Rusch , B. Gottel , S. Beer , T. Zwick
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摘要: A packaging solution for single-chip millimeter-wave transceivers is presented. It integrates an antenna into the lid of chip package. Multi-layer organic materials are used as substrate. prototype demonstrates feasibility process and performance. consists three parts: package base; a MMIC dummy that allows measuring including flip interconnect; 122-GHz grid array antenna. The complete antenna-in-package measured using probe based measurement system.
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