Seeded epitaxy of metals by sputter deposition
作者： G. R. Harp , S. S. P. Parkin
DOI: 10.1063/1.112507
关键词: Sputtering 、 Chemical engineering 、 Thin film 、 Metallurgy 、 Substrate (electronics) 、 Crystal structure 、 Metal 、 Epitaxy 、 Sputter deposition 、 Materials science 、 Crystal
摘要: It is not generally appreciated that crystalline metallic thin film structures can be prepared using sputter deposition techniques by growth onto single substrates. Three systems, fcc Co/Cu(100), bcc Co/Cr(100), and hcp Co/Ru(1013) multilayers are described in detail from a comprehensive study of more than 40 different systems. shown the use ‘‘seed’’ layers readily allows preparation crystal and/or orientations for same substrate.
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