Fill pattern in kerf areas to prevent localized non-uniformities of insulating layers at die corners on semiconductor substrates
作者： George Wong
DOI:
关键词: Die (integrated circuit) 、 Integrated circuit 、 Semiconductor 、 Layer (electronics) 、 Electronic engineering 、 Planar 、 Chip 、 Materials science 、 Optoelectronics 、 Liquid-crystal display 、 Coating
摘要: A method for making a planar spin-on-glass (SOG) layer over integrated circuits at the corners of chip (die) areas is achieved. This allows more reliable to be made, and particularly useful liquid crystal displays (LCDs) by eliminating optical distortion LCD die areas. When conducting patterned form portions areas, concurrently fill in kerf The spacing between edges selected have width sufficiently narrow provide uniform coating SOG without buildup SOG. After depositing thin SiO x cap layer, deposited. also prevents dishing when chem-mech polished back. process steps this invention can repeated multilevels electrical interconnections as required complete causing non-uniformity corners.
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