Jig for manufacturing semiconductor devices and method for manufacturing the jig
作者： Yoshihiro Saeki
DOI:
关键词: Engineering drawing 、 Wafer 、 Mechanical engineering 、 Semiconductor device 、 Chip 、 Wafer dicing 、 Engineering
摘要: A jig is used for dicing a semiconductor device on which plurality of chip regions are formed. The includes partitions that forms grids and bottom wall the supported. When wafer placed jig, support such at least one cavity defined by wafer, partitions, wall. negative pressure created in recesses evacuating air from recesses. diced into chips. returned to atmospheric pressure. Then, each chips picked up jig.
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