Light emitting diode package with photoresist reflector and method of manufacturing
作者： Hao-Wei Ku , Yung-Chang Chen , Hsin-Hung Chen , Fu-Wen Liu , Hsin-Hsien Wu
DOI:
关键词: Optoelectronics 、 Lithography 、 Materials science 、 Light-emitting diode 、 Photoresist 、 Diode 、 Wafer 、 Optics 、 Reflector (antenna)
摘要: Optical emitters are fabricated by forming and shaping photoresist reflectors on a package wafer using lithography processes, bonding Light-Emitting Diode (LED) dies to the wafer.
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