Led chip assembly, led package, and manufacturing method of led package
作者： Shinya Narita , Hideki Hirotsuru , Satoshi Higuma
DOI:
关键词:
摘要: Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the package, and an chip assembly used in package. The characterized that (10) bonded to circuit board (11) created by forming metal circuitry (3) on substrate (5) insulation layer (4) therebetween, whereas (1) are connected via electrical connection member (9), at least encapsulated resin encapsulant (8) including fluorescent material.
lens.org 参考文章(12)
Yukihiro Shimasaki, Toshiyuki Asahi, Koji Shimoyama, Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition ,(2010)
Masahisa Sobue, Hisayuki Imamura, Tsunehiro Kawata, Shigeyuki Hamayoshi, Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate ,(2004)
Michael R. Krames, Paul S. Martin, John Edward Epler, Package-integrated thin film LED ,(2006)
Satoshi Higuma, Hideo Tsukamoto, Goh Iwamoto, Nobuyuki Hashimoto, Hideki Hirotsuru, Aluminum/silicon carbide composite and radiating part comprising the same ,(2007)
Hideo Tsukamoto, Hideki Hirotsuru, Yosuke Ishihara, Composite substrate for led light emitting element, method of production of same, and led light emitting element ,(2010)
Yasuhiko Nomura, Masayuki Hata, Semiconductor element and method for manufacturing same ,(2007)
Shuhei Ishikawa, Seiji Yasui, Hiroyuki Takeuchi, 信亮 中山, 誠二 安井, Nobusuke Nakayama, 修平 石川, Takeshi Suzuki, Takashi Mitsui, 広幸 竹内, 任 三井, 健 鈴木, Heat sink material and its manufacturing method ,(2000)
Tamura Tetsushi, Tanimoto Noriyasu, Ogata Toshibumi, Kitazono Toshiro, LIGHT EMITTING DEVICE, INDICATING DEVICE AND LIGHTING DEVICE USING THE LIGHT EMITTING DEVICE, AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE ,(2007)
Kimiya Miyashita, 光 佐藤, 公哉 宮下, Hikari Sato, Submount substrate for led, manufacturing method thereof, and light emitting device using the substrate ,(2006)
Tatsumi Toru, Aketagawa Kenichi, Sakai Sumio, METHOD FOR FORMING THIN FILM ,(1993)