Led package for uniform color emission
作者： Chang Shu Lee , Ming Lu , Shan Mei Wan
DOI:
关键词:
摘要: A light emitting diode package for one or more diodes mounted on a substrate. frame is disposed at least portion of the substrate and substantially surrounds, but does not contact, diode. The transparent to emitted from includes first wavelength converting materials. materials, which may be phosphors, convert emission different wavelength. cover covers within frame. layer second materials differing in material concentration converted combinations
lens.org 参考文章(26)
Hyo Suh, Hee Park, Masayoshi Koike, Wavelength-convertible light emitting diode package ,(2006)
Andrew Glovatsky, Harvinder Singh, Wire bond led lighting unit ,(2007)
Scott West, Phosphor-converted led ,(2009)
Seon Goo Lee, Kyung Taeg Han, Seong Yeon Han, Chip coated light emitting diode package and manufacturing method thereof ,(2010)
Shinya Narita, Hideki Hirotsuru, Satoshi Higuma, Led chip assembly, led package, and manufacturing method of led package ,(2010)
Toshiyuki Takada, Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device ,(2008)
Chao-Chin Wu, Chia-Tin Chung, Light-mixing type LED package structure for increasing color render index ,(2010)
Hoe Sup Soh, Cheol Se Kim, Light-emitting diode chip for backlight unit, manufacturing method thereof, and liquid crystal display device including the same ,(2007)