Substrate supporting unit, and apparatus and method for polishing substrate using the same
作者： Taek Youb Lee
DOI:
关键词: Engineering drawing 、 Materials science 、 Wafer 、 Substrate (printing) 、 Optoelectronics 、 Polishing
摘要: Provided are a substrate supporting unit and an apparatus method for polishing using the same. The vacuum-absorbs bottom surface of during process, supports in state where is upwardly spaced from to clean post-cleaning process. Therefore, same, process on top surfaces may be sequentially performed supported by single wafer type unit.
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