Alkoxysilane/organic polymer composition for thin insulating film production and use thereof
作者： Tsuneaki Tanabe , Takaaki Ioka
DOI:
关键词: Permittivity 、 Composite number 、 Condensation 、 Solvent 、 Chemical engineering 、 Porosity 、 Thin film 、 Layer (electronics) 、 Organic chemistry 、 Materials science 、 Semiconductor
摘要: An alkoxysilane/organic polymer composition for the production of thin insulating films which comprises (A) a specific alkoxysilane, (B) organic polymer, and (C) solvent is alkoxysilane an having amide group and/or ester group; film silica/organic composite obtained by forming into film, subjecting in to hydrolysis condensation with dehydration cause gel, removing remaining film; porous silica from therefrom. The two not only have low permittivity are suitable use as layer multilayer wiring structure semiconductor element, but also can be produced method easily practicable current element processes.
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