Investigation of Interfacial Delamination in Electronic Packages
作者： H. Fan , M. M. F. Yuen
DOI: 10.1007/978-1-4614-1728-6_11
关键词: Molecular dynamics 、 Finite element method 、 Cohesive zone model 、 Interfacial delamination 、 Nanoscopic scale 、 Electronic packages 、 Materials science 、 Composite material 、 Ultimate tensile strength 、 Cohesive element
摘要: In this study, a multiscale approach was proposed to study delamination in bi-material structure, which bridge molecular dynamics method and finite element using cohesive zone model. Cohesive model parameters were derived from an interfacial under mechanical loading assigned the representing behavior. Based on multi-scale model, material behavior at nanoscale passed onto continuum tensile condition.
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