Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation

摘要: Copper-epoxy molding compound (Cu-EMC) interface is known to be the weakest joint in electronic packages, which causes delamination during a reliability test. A prime reason lack of adhesion between Cu and epoxy compound. To solve problem, self-assembly monolayer (SAM) introduced improve copper-epoxy system. Thiols/disulfides, can effectively deposited on surface, were selected as SAM act surface modifier substrate. The selection thiols/disulfides candidate with an appropriate tail group essential for enhancement. promote adhesion, structures should able form high density covalent bonds EMC. This paper focuses use molecular dynamics (MD) simulation study effect Cu-SAM-EMC data used means select candidates good interfacial strength. In this study, MD models system bonding optimized built evaluate energy EMC coated results show that changed different coatings modelling compared experimental button shear data. test shows when substrates have been amine/amide groups, increased significantly. consistent qualitative trend observed calculated by simulations. sheared samples, analysed time-of-flight secondary ion mass spectrometer techniques, further confirmed existence at interface. proves key mechanism enhancing adhesion. work illustrates help understanding behavior polymer scale. useful tool structure promotion