Advanced Bonding/Joining Techniques
作者： Chin C. Lee , Pin J. Wang , Jong S. Kim
DOI: 10.1007/978-0-387-78219-5_2
关键词: Electronic packaging 、 Wire bonding 、 Composite material 、 Anodic bonding 、 Bonding in solids 、 Thermocompression bonding 、 Soldering 、 Adhesive bonding 、 Interconnect technology 、 Materials science
摘要: This chapter covers six major bonding and joining techniques including adhesive techniques, lead-free soldering processes, silver–indium processes for high temperature applications, solid-state technology, silver flip-chip interconnect 10 μm sliver joints made by 250 °C processes.
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