Bonding Technologies in Manufacturing Engineering
作者： S.M. Homayouni , M.R. Vasili , T.S. Hong
DOI: 10.1016/B978-0-08-096532-1.00609-9
关键词:
摘要: Bonding is an important process used in all fields of industry, where the tight joining two materials required. It includes a wide variety processing technologies that can be placed framework chemistry, physics, and science. Although most these bonding processes have only recently appeared textbooks, basic phenomena been known for many centuries. Choosing appropriate may result improved end-use performance, increased efficiency, greater design flexibility. Through various techniques, this study aims at investigating following ones: direct bonding, thermocompression surface activated eutectic adhesive glass frit bonding. The characteristic features techniques with respect to their many-sided aspects review current state art each technique are briefly outlined chapter.
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