Hermeticity of eutectic bond layers for sensor packages on wafer-level
作者： A. Schneider , H. Rank , R. Muller-Fiedler , O. Wittler , H. Reichl
DOI: 10.1109/ESTC.2010.5642817
关键词:
摘要: In MEMS industry there is a high demand for reliable hermetic wafer-level encapsulation. This paper presents methodology to monitor the pressure inside package after bonding process. Therefore, novel micro-electro-mechanical resonators designed as double ended tuning forks (DETFs) were built measure quality factor Q function of cavity pressure. Obtained experimental results clearly verified feasibility developed structures, providing simple method evaluate hermeticity wafer technologies.
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