Eutectic wafer bonding for 3-D integration
作者： Mario Baum , Chenping Jia , Marco Haubold , Maik Wiemer , Arnold Schneider
DOI: 10.1109/ESTC.2010.5642870
关键词: Mechanical bond 、 Wafer bonding 、 Eutectic system 、 Nanotechnology 、 Microelectromechanical systems 、 Wire bonding 、 Wafer 、 Integrated circuit 、 Eutectic bonding 、 Materials science
摘要: Successful commercialization of MEMS products extremely depends on cost factors. Especially the role integration technologies like packaging at different levels, combining with integrated circuits, and to realize 3-dimensional packaged devices is more important than ever. Bonding wafer level are key factors for 3-d integration, realizing mechanical bond fulfilling certain requirements strength, hermeticity, reliability as well electrical interconnection functional components. From a great variety bonding techniques eutectic has got special importance today because both hermetically sealed packages interconnects could be performed within one process. Furthermore, there some advantages such low processing temperature, resulting stress, high strength. These properties mainly investigated up today. Since early 90-ies known from very large scale (VLSI) used often in industry. Even before that time processes were already field chip bonding. Within this paper development investigation least two will described characterized. Although micro structural shown, realization test focused clearly. With an structures properties, hermeticity bonds measured evaluated. At it concluded outlook feasibility smart systems.
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