Hermeticity Testing and Failure Analysis of MEMS Packages
作者： I. de Wolf , A. Jourdain , P. de Moor , H. A.C. Tilmans , L. Marchand
DOI: 10.1109/IPFA.2007.4378075
关键词:
摘要: Several microsystem applications require hermetic or semi- packages. It is for this reason mandatory to be able check the hermeticity of these The standard tests, using gross leak and fine leak, work very well large cavities, but might give erroneous results small cavities as typically used MEMS. We discussed different alternative test methods.
sci-hub.se 参考文章(17)
W. H. Weber, M. Zanini-Fisher, M. J. Pelletier, Using Raman Microscopy to Detect Leaks in Micromechanical Silicon Structures Applied Spectroscopy. ,vol. 51, pp. 123- 129 ,(1997) , 10.1366/0003702971938876
Steven M. Thornberg, Kevin R. Zavadil, James A. Ohlhausen, Michael R. Keenan, Diane E. Peebles, Gerald A. Knorovsky, Danny O. MacCallum, Brooke M. Nowak-Neely, Ion C. Abraham, Richard A. Plass, Unified characterization of surfaces and gases in MEMS devices Proceedings of SPIE. ,vol. 5343, pp. 186- 193 ,(2004) , 10.1117/12.524777
Piet De Moor, Spyros Kavadias, Vladimir N. Leonov, Chris A. Van Hoof, Process development of fast and sensitive polySiGe microbolometer arrays Photodetectors : materials and devices. Conference. ,vol. 4288, pp. 94- 99 ,(2001) , 10.1117/12.429397
Noboru Yamazoe, Yasuhiro Shimizu, Humidity sensors: Principles and applications Sensors and Actuators. ,vol. 10, pp. 379- 398 ,(1986) , 10.1016/0250-6874(86)80055-5
D. Veyrié, D. Lellouchi, J.L. Roux, F. Pressecq, A. Tetelin, C. Pellet, FTIR spectroscopy for the hermeticity assessment of micro-cavities Microelectronics Reliability. ,vol. 45, pp. 1764- 1769 ,(2005) , 10.1016/J.MICROREL.2005.07.091
A. Margomenos, L.P.B. Katehi, Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS IEEE Transactions on Microwave Theory and Techniques. ,vol. 52, pp. 1626- 1636 ,(2004) , 10.1109/TMTT.2004.828467
WM Van Spengen, Piotr Czarnecki, Robert Puers, JTM Van Beek, Ingrid De Wolf, The influence of the package environment on the functioning and reliability of RF-MEMS switches international reliability physics symposium. pp. 337- 341 ,(2005) , 10.1109/RELPHY.2005.1493108
B. Ziaie, J.A. Von Arx, M.R. Dokmeci, K. Najafi, A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators IEEE\/ASME Journal of Microelectromechanical Systems. ,vol. 5, pp. 166- 179 ,(1996) , 10.1109/84.536623
Piet De Moor, Kris Baert, Ingrid De Wolf, Anne Jourdain, Harrie A. C. Tilmans, Ann Witvrouw, Chris A. Van Hoof, Characterization of (near) hermetic zero-level packages for MEMS Reliability, packaging, testing, and characterization of MEMS / MOEMS. Conference. ,vol. 5716, pp. 26- 35 ,(2005) , 10.1117/12.596190
Michael G. Kovac, David Chleck, Philip Goodman, A New Moisture Sensor for "In-Situ" Monitoring of Sealed Packages 15th International Reliability Physics Symposium. pp. 85- 91 ,(1977) , 10.1109/IRPS.1977.362776