Characterization of (near) hermetic zero-level packages for MEMS
作者： Piet De Moor , Kris Baert , Ingrid De Wolf , Anne Jourdain , Harrie A. C. Tilmans
DOI: 10.1117/12.596190
关键词:
摘要: Zero-level packaging, i.e. the encapsulation of MEMS device at wafer level, is an essential technique for miniaturization and cost reduction. A large number different capping sealing materials techniques can be used. However, testing qualification this type packaging devices requires special techniques. conventional new characterization mechanical hermeticity are presented, as well overview about outgasing measurements reliability testing.
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A. Jourdain, P. De Moor, S. Pamidighantam, H.A.C. Tilmans, Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices international conference on micro electro mechanical systems. pp. 677- 680 ,(2002) , 10.1109/MEMSYS.2002.984361
Y. Oya, A. Okubora, M. Van Spengen, P. Soussan, S. Stoukatch, X. Rottenberg, P. Ratchev, H. Tilmans, W. De Raedt, E. Beyne, P. De Moor, I. De Wolf, K. Bae, A reliable and compact polymer-based package for capacitive RF-MEMS switches international electron devices meeting. pp. 31- 34 ,(2004) , 10.1109/IEDM.2004.1419056
A. Jourdain, S. Brebels, W. De Raedt, H. A. C. Tilmans, Influence of 0-level packaging on the microwave performance of RF-MEMS devices 2001 31st European Microwave Conference. pp. 1- 5 ,(2001) , 10.1109/EUMA.2001.339146
Steven M. Thornberg, Kevin R. Zavadil, James A. Ohlhausen, Michael R. Keenan, Diane E. Peebles, Gerald A. Knorovsky, Danny O. MacCallum, Brooke M. Nowak-Neely, Ion C. Abraham, Richard A. Plass, Unified characterization of surfaces and gases in MEMS devices Proceedings of SPIE. ,vol. 5343, pp. 186- 193 ,(2004) , 10.1117/12.524777
Hocine Ziad, Christiaan Baert, Harrie A. C. Tilmans, Design considerations of the electrical contacts in (micro)relays Proceedings of SPIE. ,vol. 2882, pp. 210- 217 ,(1996) , 10.1117/12.250706
Piet De Moor, Spyros Kavadias, Vladimir N. Leonov, Chris A. Van Hoof, Process development of fast and sensitive polySiGe microbolometer arrays Photodetectors : materials and devices. Conference. ,vol. 4288, pp. 94- 99 ,(2001) , 10.1117/12.429397
Yi Tao, Ajay P. Malshe, Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Microelectronics Reliability. ,vol. 45, pp. 559- 566 ,(2005) , 10.1016/J.MICROREL.2004.08.004
C. Rusu, H. Jansen, R. Gunn, A. Witvrouw, Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process symposium on design, test, integration and packaging of mems/moems. pp. 245- 250 ,(2003) , 10.1109/DTIP.2003.1287045
A. Jourdain, K. Vaesen, J.M. Scheer, J.W. Weekamp, J.T.M. van Beek, H.A.C. Tilmans, From zero- to second-level packaging of RF-MEMS devices international conference on micro electro mechanical systems. pp. 36- 39 ,(2005) , 10.1109/MEMSYS.2005.1453861
A. Jourdain, H. Ziad, P. De Moor, H.A.C. Tilmans, Wafer-scale 0-level packaging of (RF-)MEMS devices using BCB symposium on design, test, integration and packaging of mems/moems. pp. 239- 244 ,(2003) , 10.1109/DTIP.2003.1287044